高精度均匀干燥技术
VCD - Vacuum Chamber Dryer
真空压力≥ 13 Pa
VCD - Vacuum Chamber Dryer
真空压力≥ 13 Pa
HVCD - Heated Vacuum Chamber Dryer
Temp.40~80 ± 2 °C, Max 150 °C
HPCP - Baking Oven System
HP Temp.120 ± 1 °C, Max 150 °C
CP Temp.23 ± 1 °C
PI Oven - Multi-Piece Chamber
Temp.450 ± 5 °C, Max. 500 °C
PI Oven - 1-Piece Chamber
Temp.450 ± 5 °C, Max. 500 °C