PLP - Panel Level Packaging Line ㆍCluster Tool System (EFEM ~ Coating ~ Drying) ㆍ兼容玻璃基板与EMC塑料基板 生产效率 Substrate Warpage Control Feature真空吸附槽线优化 应用了物理翘曲控制装置 涂布配方的精密控制 Warpage<10㎛ (Pattern Glass / Glass+ABF / EMC塑料基板)
